lead-free parts pb super bright rectangle type led lamps doc. no : qw0905-L9UG15243-PF rev : a date : 09 - jun. - 2006 data sheet L9UG15243-PF ligitek electronics co.,ltd. property of ligitek only
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only part no. L9UG15243-PF package dimensions page 1/5 1.90 3.1 1.94 4.0 1.0min 25.0min + - 3.28 1.5max 0.5 typ 2.54typ 60 100% 30 50% 0 25% 75% -30 -60 50% 100%75% 25% 0
esd symbol i fp pd ir t opr i f color lens water clear tstg note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 operating temperature material part no algainp L9UG15243-PF green emitted storage temperature forward current electrostatic discharge( * ) reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter -40 ~ +85 spectral halfwidth nm forward voltage @20ma(v) viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm typ. 90 57420 2.6 1.750 max. min.min. 122 -40 ~ +100 page 2/5 ma 30 2000 10 75 60 v a ma mw ratings 9ug unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. L9UG15243-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0 0.5 500 2.03.04.05.0 0.8 40 -20 -4080100 60 0 0.5 1.0 1.5 2.0 0.9 1.2 1.0 1.1 1.0 1.5 2.0 2.5 550600650 0 0.5 1.0 2.5 3.0 20 0 20 -400 -2080 4060100 3.0 9ug chip 3/5 page part no. L9UG15243-PF
page 4/5 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 5 /sec max 260 c3sec max temp( c) 260 120 100 50 2 /sec max 0 0 25 preheat 60 seconds max part no. L9UG15243-PF
5/5 page ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 description test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item high temperature storage test operating life test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. low temperature storage test high temperature high humidity test thermal shock test solder resistance test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. reliability test: mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. part no. L9UG15243-PF
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